Abstract
A materials revolution is underway, and there are profound implications for electronic packaging materials. Composites, especially metal-matrix composites, are playing a key role, because of their unique and tailorable combinations of properties; light weight; and low-cost, net-shape fabrication potential.
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An erratum to this article is available at http://dx.doi.org/10.1007/BF03222850.
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Zweben, C. Metal-matrix composites for electronic packaging. JOM 44, 15–23 (1992). https://doi.org/10.1007/BF03222270
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DOI: https://doi.org/10.1007/BF03222270