Abstract
Copper alloys containing 4 at. pct of a solute (Al, Au, Ga, Ni, Pd, Rh, and Zn) were cold worked and annealed below the recrystallization temperature to study the effect of different solute species on the anneal hardening. By measuring the flow stress at small bending strains, it was found that anneal hardening occurs with all solutes and that the magnitude increases with the misfit of the solute atoms. This indicates that solute segregation to dislocations and the resulting binding force is the primary cause of anneal hardening.
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J. M. VITEK, formerly with the Max Planck Institut für Metallforschung
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Vitek, J.M., Warlimont, H. The mechanism of anneal hardening in dilute copper alloys. Metall Trans A 10, 1889–1892 (1979). https://doi.org/10.1007/BF02811734
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DOI: https://doi.org/10.1007/BF02811734