Abstract
Metallic solid solutions of CuFe are produced by simultaneous condensation of both components onto a sapphire substrate held at 80 K. The electrical resistivity of the CuFe films is measured as a function of temperature throughout the whole concentration range. Maxima in the residual resistivity appear at 20 at-% and 80 at-% Fe. A low temperature minimum in the electrical resistivity is observed on the Fe rich side of the system.
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Korn, D., Pfeifle, H. & Niebuhr, J. Electrical resistivity of metastable copper-iron solid solutions. Z Physik B 23, 23–26 (1976). https://doi.org/10.1007/BF01322256
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DOI: https://doi.org/10.1007/BF01322256