Abstract
The influence of annealing ambient conditions and deposited passivation materials on indium-gallium-zinc-oxide (IGZO) thin-film transistor (TFT) performance is investigated. Results from annealing experiments confirm that a nominal exposure to oxidizing ambient conditions is required, which is a function of temperature, time and gas environment. Nitrogen anneal with a controlled air ramp-down provided the best performance devices with a mobility (μsat) of 11-13 cm2/V-s and subthreshold slope (SS) of 135-200 mV/dec, with some hysteresis. Plasma-deposited passivation materials including sputtered quartz and PECVD SiO2demonstrated a significant increase in material conductivity, which was not significantly reversible by an oxidizing ambient anneal. E-beam evaporated Al2O3 passivated devices that were annealed in air at 400 °C demonstrated improved stability over time and suppressed hysteresis in comparison to unpassivated devices. Devices which were passivated with B-staged bisbenzocyclobutene-based (BCB) resins and annealed in air at 250 °C also exhibited suppressed hysteresis.
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Mudgal, T., Walsh, N., Manley, R.G. et al. Passivation and Annealing for Improved Stability of High Performance IGZO TFTs. MRS Online Proceedings Library 1692, 51–56 (2014). https://doi.org/10.1557/opl.2014.906
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DOI: https://doi.org/10.1557/opl.2014.906