Abstract
Stretchable electronics fabrication generally relies on fine-tuning adhesion forces, putting some restrictions on what the carrier layer can be. In contrast to adhesion, mechanical tangling makes more kinds of carrier materials available. Antibacterial, conductive, heat-responsive and other functions can be brought in by fiber networks as long as they are compatible with the highly selective silicon etch process. Mechanical grippers can also bring electronic contacts from one side of a mesh to the other, which is difficult to do on continuous thin films of other soft materials like silicone or polyimide. Our solution uses mechanical strain to produce large arrays of redundant grippers from planar thin-film designs.
Article PDF
Similar content being viewed by others
Explore related subjects
Discover the latest articles, news and stories from top researchers in related subjects.Avoid common mistakes on your manuscript.
References
A. Koh, et al., Sci. Transl. Med. 8 (366), 366ra165 (2016)
J.A. Rogers, T. Someya, and Y. Huang, Science 327 (5973), 1603 (2010)
Popular Embroidery Techniques Used to Decorate Fabrics. Available at: http://nanetteparker.hubpages.com/hub/Popular-Embroidery-Techniques-Used-to-Decorate-Fabrics (accessed 26 September 2018).
Creative Sewing. Available at: http://www.creativesewing.co.nz/ (accessed 26 September 2018).
Loominous. Available at: http://www.loominous.co.uk/studio.html (accessed 26 September 2018).
Cornell University: Fabrics of Our Livelihoods. Available at: http://smallfarms.cornell.edu/2011/07/04/fabrics-of-our-livelihoods/ (accessed 26 September 2018).
CMI. Available at: https://www.colonialmills.com/PublicStore/catalog/BraidingProcess,156.aspx (accessed 26 September 2018).
Textile Innovation Knowledge Platform. Available at: http://www.tikp.co.uk/knowledge/technology/coating-and-laminating/laminating (accessed 26 September 2018).
Custom Fabric Printing. Available at: http://sophiasdecor.blogspot.it/2012/09/insidespoonflower-custom-fabric.html (accessed 26 September 2018).
Durable water repellent. Available at: http://en.wikipedia.org/wiki/Durable_water_repellent_(accessed 26 September 2018).
T. Bozhi, et al., Nat. Mater. 11 (11), 986 (2012)
D. Bishop, F. Pardo, C. Bolle, R. Giles and V. Aksyuk, J. Low. Temp. Phys. 169(5–6), 386 (2012)
B.Y. Ahn, E.B. Duoss, M.J. Motala, X. Guo, S.L. Park, Y. Xiong, J. Yoon, R.G. Nazzo, J.A. Rogers and J.A. Lewis, Science 323 (5921), 1590 (2009)
R. Gagler, A. Bugacov, B.E. Koel and P.M. Will, J. Micromech. Microeng. 18 (5), 055025 (2008)
B. Gimi, T. Leong, Z. Gu, M. Yang, D. Artemov, Z.M. Bhujwalla and D.H. Gracias, Biomed. Microdevices 7 (4), 341 (2005)
R. Fernandes and D.H. Gracias, Adv. Drug Deliv. Rev. 64 (14), 1579 (2012)
T.G. Leong, P.A. Lester, T.L. Koh, E.K. Call and D.H. Gracias, Langmuir. 23 (17), 8747 (2007)
J.H Cho, A. Azam and D.H. Gracias, Langmuir. 26 (21), 16534 (2010)
J.S. Randhawa, S.S. Gurbani, M.D. Keung, D.P. Demers, M.R. Leahy-Hoppa and D.H. Gracias, Appl. Phys. Lett. 96 (19), 191108 (2010)
J.H. Cho, M.D. Keung, N. Verellen, L. Lagae, V.V. Moshchalkov, P. Van Dorpe and D.H. Gracias, Small. 7 (14), 1943 (2011)
J.C. Breger, C. Yoon, R. Xiao, H.R. Kwag, M.O. Wang, J.P. Fisher, T.D. Nguyen and D.H. Gracias, ACS Appl. Mater. Interfaces. 7 (5), 3398 (2015)
V.B. Shenoy and D.H. Gracias, MRS Bulletin. 37 (09), 847 (2012)
K. Malachowski, M. Jamal, Q. Jin, B. Polat, C.J. Morris and D.H. Gracias, Nano Lett. 14 (7), 4164 (2014)
V. Ya. Prinz, V.A. Seleznev, A.K. Gutakovsky, A.V. Chehovskiy, V.V. Preobrazhenskii, M.A. Putyato and T.A. Gavrilova, Physica E 6 (1), 828 (2000)
O.G. Schmidt and K. Eberl, Nature 410 (6825), 168 (2001)
M.N. Huang, L. Boone, M. Roberts, D.E. Savage, M.G. Lagally, N. Shaji, H. Qiu, R. Blick, J.A. Nairn and F. Liu, Adv. Mater. 17 (23), 2860 (2005)
O.G. Schmidt and N.Y. Jin-Phillipp, Appl. Phys. Lett. 78, 3310 (2001)
P.O Vaccaro, K. Kubota and T. Aida, Appl. Phys. Lett. 78, 2852 (2001)
E. Moiseeva, Y. M. Senousy, S. McNamara, and C. K. Harnett, J. Micromech. Microeng. 17 (9), N63 (2007)
L. Malkinski and E. Rahmatollah, Magnetic Materials (InTech, 2016), pp.223–248, Retrieved from intechopen
F. I. Chang, R. Yeh, G. Lin, P.B. Chu, E. G. Hoffman, E. J. Kruglick, K. S. J. Pister, and M. H. Hecht, Proc. SPIE 2641, pp. 117–129 (1995)
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Challa, S., Ternival, C., Islam, S. et al. Transferring Microelectromechanical Devices to Breathable Fabric Carriers with Strain-Engineered Grippers. MRS Advances 4, 1327–1334 (2019). https://doi.org/10.1557/adv.2019.6
Published:
Issue Date:
DOI: https://doi.org/10.1557/adv.2019.6