Abstract
Template two step electrodeposition method and atomic layer deposition were used to synthesize copper nanowires of varied length (1.2 to 26.2 μm) and copper nanowires coated with titanium dioxide. As a result of the atomic layer deposition of TiO2, coated nanowires demonstrated an up to 10-fold decrease in the wetting angle, compared with uncoated nanowires. It was found the dissipation rate is substantially higher for nanowires coated by the atomic layer deposition method (100 s) as compared with the uncoated copper nanowires (400 s), which assumes the positive properties of water propagation along the surface, necessary for improving the heat transfer. It was also found that the water contact angle for uncoated nanowires and those coated with TiO2 by the atomic layer deposition (ALD) gradually increases as the samples are kept in air. A gradual increase in wettability was also observed for smooth silicon wafers coated by ALD of TiO2, which were exposed to air. On the coated silicon substrates, the wetting angle gradually increased from 10° to approximately 56° in the course of four days. In addition, it was shown that copper nanowires coated with TiO2 by the atomic layer deposition method have an excellent corrosion resistance, compared with uncoated nanowires, when brought in contact with air and water.
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References
Zhu, X., Wang, H., Liao, Q., et al., Exp. Therm. Fluid Sci., 2009, vol. 33, no. 6, pp. 947–954.
Glassford, S., Chan, K.L.A., Byrne, B., and Kazarian, S.G., Langmuir, 2012, vol. 28, no. 6, pp. 3174–3179.
Shin, Y.N., Kim, B.S., Ahn, H.H., et al., Appl. Surf. Sci., 2008, vol. 255, no. 2, pp. 293–296.
Ju, J., Xiao, K., Yao, X., et al., Adv. Mater., 2013, vol. 25, no. 41, pp. 5937–5942.
Daniel, S., Chaudhury, M.K., and Chen, J.C., Science, 2001, vol. 291, no. 5504, pp. 633–636.
Liao, Q., Gu, Y.B., Zhu, X., et al., J. Enhanced Heat Transfer, 2007, vol. 14, no. 3, pp. 243–256.
Chandesris, B., Soupremanien, U., and Dunoyer, N., Colloids Surf., A, 2013, vol. 434, pp. 126–135.
Meyyappan, S., Shadnam, M.R., and Amirfazli, A., Langmuir, 2008, vol. 24, no. 6, pp. 2892–2899.
Yu, X., Wang, Z., Jiang, Y., and Zhang, X., Langmuir, 2006, vol. 22, no. 10, pp. 4483–4486.
Hu, B., Xue, L., Yang, P., and Han, Y., Langmuir, 2010, vol. 26, no. 9, pp. 6350–6356.
Wang, L., Peng, B., and Su, Z., Langmuir, 2010, vol. 26, no. 14, pp. 12203–12208.
Ito, Y., Heydari, M., Hashimoto, A., et al., Langmuir, 2007, vol. 23, no. 4, pp. 1845–1850.
Zhang, J., Xue, L., and Han, Y., Langmuir, 2005, vol. 21, no. 1, pp. 5–8.
Li, X., Dai, H., Tan, S., et al., J. Colloid Interface Sci., 2009, vol. 340, no. 1, pp. 93–97.
Sun, C., Zhao, X.-W., Han, Y.-H., and Gu, Z.-Z., Thin Solid Films, 2008, vol. 516, no. 12, pp. 4059–4063.
Huang, Z., Lu, Y., Qin, H., et al., Adv. Eng. Mater., 2012, vol. 14, no. 7, pp. 491–496.
Zhang Yong, C.J., Pi Pihui, Wen Xiufang, et al., Prog. Chem., 2011, vol. 23, no. 12, pp. 2457–2465.
Hu, Y., Cheng, J., Zhang, W., et al., Int. J. Heat Mass Transf., 2013, vol. 67, pp. 416–419.
Das, A.K., Das, P.K., and Saha, P., Exp. Therm. Fluid Sci., 2007, vol. 31, no. 8, pp. 967–977.
Phan, H.T., Caney, N., Marty, P., et al., Int. J. Heat Mass Transf., 2009, vol. 52, nos. 23–24, pp. 5459–5471.
Wu, W., Bostanci, H., Chow, L.C., et al., Int. J. Heat Mass Transf., 2010, vol. 53, nos. 9–10, pp. 1773–1777.
Takata, Y., Hidaka, S., Cao, J.M., et al., Energy, 2005, vol. 30, nos. 2–4, pp. 209–220.
Phan, H.T., Caney, N., Marty, P., et al., C. R. Méc., 2009, vol. 337, no. 5, pp. 251–259.
Chen, R., Lu, M.-C., Srinivasan, V., et al., Nano Lett., 2009, vol. 9, no. 2, pp. 548–553.
Patankar, N.A., Soft Matter, 2010, vol. 6, no. 8, p. 1613.
George, S.M., Chem. Rev., 2010, vol. 110, no. 1, pp. 111–131.
Malygin, A.A., Drozd, V.E., Malkov, A.A., and Smirnov, V.M., Chem. Vap. Deposition, 2015, vol. 21, nos. 10–11–12, pp. 216–240.
Elam, J.W., Routkevitch, D., Mardilovich, P.P., and George, S.M., Chem. Mater., 2003, vol. 15, no. 18, pp. 3507–3517.
Kuznicka, B., Eng. Failure Anal., 2009, vol. 16, no. 7, pp. 2382–2387.
Ashkarran, A.A. and Mohammadizadeh, M.R., Mater. Res. Bull., 2008, vol. 43, no. 3, pp. 522–530.
Taberna, P.L., Mitra, S., Poizot, P., et al., Nat. Mater., 2006, vol. 5, no. 7, pp. 567–573.
Puurunen, R.L., J. Appl. Phys., 2005, vol. 97, no. 12, p. 121301.
Ritala, M., Leskelä, M., Nykänen, E., et al., Thin Solid Films, 1993, vol. 225, nos. 1–2, pp. 288–295.
Caputo, G., Cingolani, R., Cozzoli, P.D., Athanassiou, A., Phys. Chem. Chem. Phys., 2009, vol. 11, no. 19, pp. 3692–3700.
Kusumaatmaja, H., Blow, M.L., Dupuis, A., and Yeomans, J.M., EPL (Europhys. Lett.), 2008, vol. 81, no. 3, p. 36003.
Plawsky, J.L., Ojha, M., Chatterjee, A., and Wayner, P.C. Jr., Chem. Eng. Commun., 2008, vol. 196, no. 5, pp. 658–696.
Gallyamov, M., Nikitin, L., Nikolaev, A., et al., Kolloid. Zh., 2007, vol. 69, no. 4, pp. 448–462.
Bhattacharya, P., Gohil, S., Mazher, J., Nanotechnology, 2008, vol. 19, no. 7, p. 075709.
Wang, R., Hashimoto, K., and Fujishima, A., Nature, 1997, vol. 388, no. 6641, pp. 431–432.
Malygin, A.A., Soros. Obrazovat. Zh., 2004, vol. 8, no. 4, pp. 32–37.
Aarik, J., Aidla, A., Mändar, H., and Sammelselg, V., J. Cryst. Growth, 2000, vol. 220, no. 4, pp. 531–537.
Abdulagatov, A.I., Yan, Y., Cooper, J.R., et al., ACS Appl. Mater. Interfaces, 2011, vol. 3, no. 12, pp. 593–601.
Wang, R., Hashimoto, K., Fujishima, A., et al., Adv. Mater., 1998, vol. 10, no. 2, pp. 135–138.
McHale, G., Aqil, S., Shirtcliffe, N.J., et al., Langmuir, 2005, vol. 21, no. 24, pp. 11053–11060.
Tsai, P., Lammertink, R.G.H., Wessling, M., and Lohse, D., Phys. Rev. Lett., 2010, vol. 104, no. 11, pp. 116102.
Watanabe, T., J. Ceram. Soc. Japan, 2009, vol. 117, no. 1372, pp. 1285–1292.
Kietzig, A.-M., Hatzikiriakos, S.G., and Englezos, P., Lang muir, 2009, vol. 25, no. 8, pp. 4821–4827.
Birch, W., Carré, A., and Mittal, K.L., Developments in Surface Contamination and Cleaning, New York: Elsevier, 2008.
Kung, H.H., Transition Metal Oxides–-Surface Chemistry and Catalysis, Amsterdam Elsevier, 1989, vol.45.
McHale, G., Shirtcliffe, N.J., and Newton, M.I., Langmuir, 2004, vol. 20, no. 23, pp. 10146–10149.
Triani, G., Campbell, J.A., and Evans, P.J., Thin Solid Films, 2010, vol. 518, no. 12, pp. 3182–3189.
Li, Z., Wang, Y., Kozbial, A., et al., Nat. Mater., 2013, vol. 12, no. 10, pp. 925–931.
Zheng, J., Bogaerts, W., and Lorenzetto, P., Fusion Eng. Des., 2002, vols. 61–62, pp. 649–657.
Sobue, K., Sugahara, A., Nakata, T., et al., Surf. Coat. Technol., 2003, vols. 169–170, pp. 662–665.
Shan, C.X., Hou, X., and Choy, K.-L., Surf. Coat. Technol., 2008, vol. 202, no. 11, pp. 2399–2402.
Shan, C.X., Hou, X., Choy, K.-L., and Choquet, P., Surf. Coat. Technol., 2008, vol. 202, no. 10, pp. 2147–2151.
Abdulagatov, A., Yan, Y., Cooper, J.R., et al., ACS Appl. Mater. Interfaces, 2011, vol. 3, pp. 4593–4601.
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Original Russian Text © A.I. Abdulagatov, F.F. Orudzhev, M.Kh. Rabadanov, I.M. Abdulagatov, 2016, published in Zhurnal Prikladnoi Khimii, 2016, Vol. 89, No. 8, pp. 1015−1023.
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Abdulagatov, A.I., Orudzhev, F.F., Rabadanov, M.K. et al. Copper nanowire arrays surface wettability control using atomic layer deposition of TiO2 . Russ J Appl Chem 89, 1265–1273 (2016). https://doi.org/10.1134/S1070427216080085
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DOI: https://doi.org/10.1134/S1070427216080085