Abstract
The effect of Co addition (0.5-2.0 wt.%) on the microstructure evolution, thermal and mechanical property of Sn-0.7Cu (wt.%) solder was investigated. The microstructure of Sn-Cu alloy was refined with the addition of Co, and CoSn2 phase formed during solidification. The volume fraction of CoSn2 phase increases with the increase of Co content. The melting temperature of Sn-0.7Cu-xCo alloys increases with increasing Co content. The melting range of these alloys is small (< 4°C), and decreased with the increase of Co content. The ultimate tensile strength and microhardness of Sn-Cu-xCo (x = 0.5, 1.0, 1.5, 2.0) alloys increase with the increase of the Co content. The relationships between tensile strength/microhardness and Co content of Sn-Cu-xCo alloy are established. Meanwhile, Sn-0.7Cu-1.5Co (wt.%) and Sn-0.7Cu-2.0Co (wt.%) alloys revealed an indentation size effect. Different ISE behaviors of Sn-0.7Cu-xCo alloys are mainly related to the presence of CoSn2 phase and the volume fraction of it. The indentation creep property of Sn-Cu-xCo alloys is modified with the addition of Co. Enhanced creep property of the alloys is depended on the solid solution of Co and precipitate out of CoSn2 phase.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Y. Tseng, Y. Chang, and C. Chen, J. Electron. Mater. 44, 581 (2015).
S. Chen, Y. Chen, H. Wu, Y. Huang, and C. Chen, J. Electron. Mater. 39, 2418 (2010).
C. Du, X. Wang, and S. Tian, J. Mater. Sci. Mater. Electron. 29, 455 (2018).
C. Wang and S. Chen, J. Mater. Res. 22, 3404 (2007).
Y. Huang and S. Chen, J. Electron. Mater. 40, 62 (2011).
Z. Lai, X. Kong, Q. You, and X. Cao, Microelectron. Reliab. 68, 69 (2017).
M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, and M.A. Fazal, J. Mater. Sci. Technol. 32, 1129 (2016).
H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine, J. Electron. Mater. 26, 783 (1997).
G.S. Zhang, H.Y. Jing, L.Y. Xu, J. Wei, and Y.D. Han, J. Alloys Compd. 476, 138 (2009).
D.S. Stone, J.E. Jakes, J. Puthoff, and A.A. Elmustafa, J. Mater. Res. 25, 611 (2010).
I. Choi, B. Yoo, Y. Kim, and J. Jang, J. Mater. Res. 27, 3 (2012).
W. Liu, Y. Wang, W. Guan, Y. Ma, and Y. Huang, Electron. Compon. Mater. 33, 1 (2014).
H. Zhang, Y. Liu, L. Wang, F. Sun, X. Fan, and G. Zhang, Results Phys. 12, 712 (2019).
R.S. Ginder, W.D. Nix, and G.M. Pharr, J. Mech. Phys. Solids 112, 552 (2018).
I. Dutta, C. Park, and S. Choi, Mater. Sci. Eng. A 379, 401 (2004).
Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, J. Mater. Sci. Mater. Electron. 23, 1108 (2012).
A. Roshanghias, A.H. Kokabi, Y. Miyashita, Y. Mutoh, I. Ihara, R.G. Guan Fatt, and H.R. Madaah-Hosseini, J. Electron. Mater. 41, 2057 (2012).
Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, J. Electron. Mater. 39, 223 (2010).
R. Mahmudi, A.R. Geranmayeh, H. Khanbareh, and N. Jahangiri, Mater. Des. 30, 574 (2009).
R. Mahmudi, A.R. Geranmayeh, H. Noori, and M. Shahabi, Mater. Sci. Eng. A 491, 110 (2008).
K.M. Kumar, V. Kripesh, L. Shen, K. Zeng, and A.A.O. Tay, Mater. Sci. Eng. A 423, 57 (2006).
X. Chen, J. Zhou, F. Xue, and Y. Yao, Mater. Sci. Eng. A 662, 251 (2016).
L. Shen, P. Lu, S. Wang, and Z. Chen, J. Alloys Compd. 574, 98 (2013).
R.M. Shalaby, Mater. Sci. Eng. A 560, 86 (2013).
L. Shen, Z.Y. Tan, and Z. Chen, Mater. Sci. Eng. A 561, 232 (2013).
L. Shen, P. Septiwerdani, and Z. Chen, Mater. Sci. Eng. A 558, 253 (2012).
R. Mahmudi, A.R. Geranmayeh, S.R. Mahmoodi, and A. Khalatbari, Phys. Stat. Sol. (A) 204, 2302 (2007).
R. Mahmudi, A.R. Geranmayeh, S.R. Mahmoodi, and A. Khalatbari, J. Mater. Sci. Mater. Electron. 18, 1071 (2007).
A.R. Geranmayeh and R. Mahmudi, J. Electron. Mater. 34, 1002 (2005).
R. Mahmudi and A. Rezaee-Bazzaz, Mater. Lett. 59, 1705 (2005).
M. Kamal, A. El-Bediwi, A.R. Lashin, and A.H. El-Zarka, J. Mater. Eng. Perform. 25, 2084 (2016).
A.R. Geranmayeh, R. Mahmudi, F. Khalatbari, N. Kashi, and G. Nayyeri, J. Electron. Mater. 43, 717 (2014).
A.F. Abd El-Rehim and H.Y. Zahran, J. Alloys Compd. 695, 3666 (2017).
E. Broitman, Tribol. Lett. 65, 23 (2017).
J.R. Cahoon, W.H. Broughton, and A.R. Kutzak, Metall. Trans. 2, 1979 (1971).
B.L. Silva, A. Garcia, and J.E. Spinelli, Mater. Lett. 89, 291 (2012).
J. Fan, X. Li, Y. Su, J. Guo, and H. Fu, Mater. Des. 34, 552 (2012).
L. Han, H. Hu, and D.O. Northwood, Mater. Lett. 62, 381 (2008).
I. Manika and J. Maniks, Acta Mater. 54, 2049 (2006).
S. Chen, J. Chang, K. Pan, C. Hsu, and C. Hsu, Metall. Mater. Trans. A 44, 1656 (2013).
R. Tang and R. Tian, Binary Alloy Phase Diagrams and Crystal Structure of Intermediate Phase (Changsha (China): Central South University Press, 2009), p. 1522.
H.R. Kotadia, P.D. Howes, and S.H. Mannan, Microelectron. Reliab. 54, 1253 (2014).
L.F. Li, Y.K. Cheng, G.L. Xu, E.Z. Wang, Z.H. Zhang, and H. Wang, Mater. Des. 64, 15 (2014).
C. Andersson, P. Sun, and J. Liu, J. Alloys Compd. 457, 97 (2008).
J.W. Xian, S.A. Belyakov, T.B. Britton, and C.M. Gourlay, J. Alloys Compd. 619, 345 (2015).
Y. Tang, S.M. Luo, W.F. Huang, Y.C. Pan, and G.Y. Li, J. Alloys Compd. 719, 365 (2017).
S.M. Walley, Mater. Sci. Tech. 28, 1028 (2013).
P.M. Sargent and M.F. Ashby, Mater. Sci. Tech. 8, 594 (1992).
A. El-Bediwi, K.M. Ismail, and M. Kamal, Mater. Sci. Indian J. 9, 73 (2013).
Acknowledgments
This work was supported by Young Teachers Training Program of Henan Province Higher Education Institutions in 2018 (Grant Number 2018GGJS090), the National Natural Science Foundation of China (Grants Numbers: U1904175, 51501167); and Doctor Research Foundation of Zhengzhou University of Light Industry (Grant Number 2014BSJJ049).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no conflict of interest.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Fan, J., Zhai, H., Liu, Z. et al. Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder. J. Electron. Mater. 49, 2660–2668 (2020). https://doi.org/10.1007/s11664-020-07960-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-020-07960-y