Abstract
A geometrical shape factor was investigated for optimum thermoelectric performance of a thermoelectric module using finite element analysis. The cooling power, electrical energy consumption, and coefficient of performance were analyzed using simulation with different current values passing through the thermoelectric elements for varying temperature differences between the two sides. A dramatic increase in cooling power density was obtained, since it was inversely proportional to the length of the thermoelectric legs. An artificial neural network model for each thermoelectric property was also developed using input–output relations. The models including the shape factor showed good predictive capability and agreement with simulation results. The correlation of the models was found to be 99%, and the overall prediction error was in the range of 1.5% and 1.0%, which is within acceptable limits. A thermoelectric module was produced based on the numerical results and was shown to be a promising device for use in cooling systems.
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References
Y.W. Chang, C.H. Cheng, W.F. Wu, and S.L. Chen, Int. J. Eng. Appl. Sci. 4, 173 (2008).
S.B. Riffat and X. Ma, Appl. Therm. Eng. 23, 913 (2003).
T.M. Tritt and M.A. Subramanian, MRS Bull. 31, 188 (2006).
S.B. Riffat and X. Ma, Int. J. Energy Res. 28, 753 (2004).
J.P. Fleurial, G.J. Snyder, J.A. Herman, M. Smart, and P. Shakkottai, 34th Int. Soc. Energy Conversat. Eng. Conf. Proc. Vancouver, BC, Canada, 992569 (1999).
P. Arunkumar, P. Iswarya, S. Supraja, P. Rajarayan, and G. Balaj, Int. J. Comput. Commun. Inf. Syst. 2, 28 (2010).
S.B. Riffat, X. Ma, and R. Wilson, Appl. Therm. Eng. 26, 494 (2006).
L. Chen, F. Meng, and F. Sun, Rev. Mex. Fis. 55, 282 (2009).
S.B. Riffat and X. Ma, Int. J. Energy Res. 28, 1231 (2004).
H.J. Goldsmid, J. Thermoelectr. 4, 14 (2005).
K. Atik, 5th Int. Adv. Technol. Symp (Turkey: Karabük University, 2009).
N. Wang, C.H. Wang, J.X. Lei, and D.S. Zhu, Int. Conf. Electron. Pack. Technol. & High Density Pack., IEEE (2009).
A.F. Ioffe, Infosearch, London (1957).
D.M. Rowe, Thermoelectrics Handbook Macro to Nano (Boca Raton: CRC Taylor & Francis, 2006).
A. Bar-Cohen, G.L. Solbrekken, and K. Yazawa, IEEE Trans. Adv. Packag. 28, 2 (2005).
R.E. Simons and R.C. Chu, 16th IEEE Semi-Therm. Symp. (2000).
J.W. Vandersande and J.P. Fleurial, Proc. 15th Int. Conf. Thermoelectrics, 37 (1997).
F. Guldiken, M.Sc. Thesis, Uludag University, Bursa Turkey (2011).
P.P. Silvester and R.L. Ferrari, Finite Elements for Electrical Engineers, 3rd ed. (Cambridge: Cambridge University Press, 1996).
G.K. Miti, A.J. Moses, N. Derebasi, and D. Fox, J. Magn. Magn. Mater. 254, 262 (2003).
M. Laidi and S. Hanini, Int. J. Refrig. 36, 247 (2013).
K. Gurney, An Introduction to Neural Networks (London: UCL Press, 1999).
D. Graupe, Principles of Artificial Neural Networks (Singapore: World Scientific, 1997).
Qnet2000 Help Manual.
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Derebasi, N., Eltez, M., Guldiken, F. et al. Performance of Novel Thermoelectric Cooling Module Depending on Geometrical Factors. J. Electron. Mater. 44, 1566–1572 (2015). https://doi.org/10.1007/s11664-014-3482-x
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DOI: https://doi.org/10.1007/s11664-014-3482-x