Abstract
Interfacial reactions between Sn and Cu-xAg alloys (x = 0 at.%, 11.1 at.%, 33.3 at.%, and 50 at.%) were investigated. The as-prepared Cu-Ag alloys displayed a microstructure composed of a proeutectic (Cu) phase and a eutectic (Cu) + (Ag) structure, where the fraction of the eutectic structure increased with increasing Ag content. At 200°C and 250°C, reactions to form Cu6Sn5 and Cu3Sn phase occurred at the Sn/Cu-Ag interface, and also inside the Cu-Ag substrate along the (Ag)/(Cu) interphase interface. The penetrated growth behavior by way of the (Ag)/(Cu) interphase interface accelerated the growth rate of the intermetallic compounds and the consumption of the Cu-Ag substrates. A comparison between conventional Sn/Cu and Sn/Cu-Ag systems indicated that addition of Ag to Cu had a significant accelerating effect on the Sn/Cu-xAg interfacial reaction to form Cu6Sn5.
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References
M. Abtew and G. Selvaduray, Mater. Sci. Eng. R 27, 95–141 (2000).
T. Laurila, V. Vuorinen, and J.K. Kivilahti, Mater. Sci. Eng. R 49, 1–60 (2005).
D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang, JOM 53, 28–33 (2001).
C.P. Lin and C.M. Chen, J. Alloys Compd. 547, 37–42 (2013).
C.P. Lin, C.M. Chen, and Y.W. Yen, J. Alloys Compd. 591, 297–303 (2014).
C.P. Lin and C.M. Chen, J. Electron. Mater. 38, 908–914 (2009).
W. Peng, E. Monlevade, and M.E. Marques, Microelectron. Reliab. 47, 2161–2168 (2007).
C.H. Kuo, H.H. Hua, H.Y. Chan, T.H. Yang, K.S. Lin, and C.E. Ho, Microelectron. Reliab. 53, 2012–2017 (2013).
C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, Mater. Sci. Eng. R 44, 1–44 (2004).
I.E. Anderson, J. Mater. Sci. 18, 55–76 (2007).
H.F. Zou, Q.K. Zhang, and Z.F. Zhang, J. Electron. Mater. 40, 1542–1548 (2011).
H.F. Zou, Q.K. Zhang, and Z.F. Zhang, Scr. Mater. 61, 308–311 (2009).
C.Y. Yu and J.G. Duh, J. Mater. Sci. 47, 6467–6474 (2012).
Q.K. Zhang, H.F. Zou, and Z.F. Zhang, J. Mater. Res. 25, 303–314 (2010).
Q.Q. Lai, L. Zhang, and N. Eustathopoulos, Acta Mater. 61, 4127–4134 (2013).
J.L. Murray, Metall. Trans. A 15, 261–268 (1984).
T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K. Zeng, and J.K. Kivilahti, J. Mater. Res. 17, 291–301 (2002).
I. Karakaya and W.T. Thompson, Bull. Alloy Phase Diagr. 8, 340–347 (1987).
S.K. Seo, S. Kang, D.Y. Shih, and H. Lee, J. Electron. Mater. 38, 257–265 (2009).
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Yang, TK., Lin, CF. & Chen, CM. Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn. J. Electron. Mater. 44, 511–517 (2015). https://doi.org/10.1007/s11664-014-3448-z
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DOI: https://doi.org/10.1007/s11664-014-3448-z