Abstract
Through the use of purification and recirculation superheating techniques on molten glass, the Ni65Cu33Co2 alloy was successfully undercooled to a maximum temperature of 292 K. High-speed photography was employed to capture the process of interface migration of the alloy liquid, allowing for an analysis of the relationship between the morphological characteristics of the alloy liquid solidification front and the degree of undercooling. Additionally, the microstructure of the alloy was examined using metallographic microscopy, leading to a systematic study of the microscopic morphological characteristics and evolution laws of the refined structure during rapid solidification. The research reveals that the grain refining mechanism of the Ni-Cu-Co ternary alloy is consistent with that of the binary alloy (Ni-Cu). Specifically, under low undercooling conditions, intense dendritic remelting was found to cause grain refinement, while under high undercooling conditions, recrystallization driven by accumulated stress and plastic strain resulting from the interaction between the liquid flow and the primary dendrites caused by rapid solidification was identified as the main factor contributing to grain refinement. Furthermore, the study highlights the significant role of the Co element in influencing the solidification rate and reheat effect of the alloy. The addition of Co was also found to facilitate the formation of non-segregated solidification structure, indicating its importance in the overall solidification process.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Herlach DM. Non-equilibrium Solidification of Undercooled Metallic Melts[J]. Mater. Sci. Eng. R., 1994, 12: 177–272
Mullis AM, Cochrane RF. Grain Refinement and the Stability of Dendrites Growing into Undercooled Pure Metals and Alloys[J]. J. Appl. Phys., 1997, 82(8): 3783–3790
Gleiter H. Nanocrystalline Materials[J]. Mater. Sci. Eng. R., 1989, 33: 223–315
Wei B, Yang C, Zhou Y. High Undercooling and Rapid Solidification of Ni-32.5%Sn Eutectic Alloy[J]. Acta Metall. Mater., 1991,39(6): 1249–1258
Xi Z, Yang G, Zhou Y. Growth Morphology of Ni3Si in High Undercooled Ni-Si Eutectic Alloy[J]. Prog. Nat. Sci., 1997, 5: 114–121
Leung KK, Chiu CP, Kui HW. Grain Refinement in Undercooled Nickel[J]. Scripta Metal. Mater., 1995, 32(10): 1559–1563
Schwarz M, Karma A, Eckler K, Herlach DM. Physical Mechanism of Grain Refinement in Solidification of Undercooled Melts[J]. Phys. Rev. Lett., 1994, 73(10): 1380–1383
Kattamis TZ. Mechanism of Establishment of Cast Microstructure During Solidification of Highly Undercooled Melts[J]. J. Cryst. Growth, 1976, 34(2): 215–220
Li J, Liu Y, Lu Y, et al. Structural Evolution of Undercooled Ni-Cu Alloys[J]. J. Cryst. Growth, 199, 192: 462–470
Powell L. The Undercooling of Silver[J]. J. Aust. Inst. Met., 1965, 10: 3 223
Jones B, Weston G. Grain Refinement in Undercooled Copper[J]. J. Aust. Inst. Met., 1970, 15: 3 167
Horvay G. The Tension Field Created by a Spherical Nucleus Freezing into Its Less Dense Undercooled Melt[J]. Int. J. Heat Mass Transfer., 1965, 8(2): 195–243
Willnecker R, Herlach DM, Feuerbacher B. Grain Refinement Induced by a Critical Crystal Growth Velocity in Undercooled Melts[J]. Appl. Phys. Lett., 1990, 56(4): 324–326
Zheng HX, Yu Y, Li JG. Microstructural Evolution of Undercooled Ni-40wt%Pb Hypermonotectic Alloy[J]. Mater. Sci. Forum, 2005, 475: 2651–2654
Dragnevski KI, Mullis AM, Cochrane RF. The Effect of Experimental Variables on the Levels of Melt Undercooling[J]. Materials Science and Engineering: A, 2004, 375–377: 485–487
Langer JS. Instabilities and Pattern Formation in Crystal Growth[J]. Rev. Modern. Phys., 1980, 52: 1–28
Kurz W, Trivedi R. Solidification Microstructure: Recent Developments and Future Directions[J]. Acta Metal. Mater., 1990, 38: 1–17
Boettinger WJ, Coriell SR, Trivedi R. In: Mehrabian R, Parrish PA eds., Rapid Solidification Processing: Principles and Technologies IV[M]. Baton Rouge, LA: Claitor’s Pulishing Division, 1988: 13–18
Li J, Liu Y, Lu Y, et al. Structural Evolution of Undercooled Ni-Cu alloys[J]. J. Cryst. Growth, 1998, 192: 462–470
AK Dahle DHJ, Thevik HJ. Modelling the Fluid Flow Induced Stress and Collappse in a Dentritic Network[J]. Metall. Mater. Trans. B., 1999: 30
Kurz W, Fisher DJ. Fundamentals of Solidification[M]. 4th Revised Edition. Switzerland: Trans. Tech. Publications Ltd., 1998: 1–292
Rappaz M. Modelling of Microstructure of Formation in Solidification Process[J]. Inter. Mater. Rev., 1989, 34: 93–123
Beckermann C, Viskanta R. Mathematical Modeling of Transport during Alloy Solidification[J]. Appl. Mech. Rev., 1993, 46: 1–27
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
All authors declare that there are no competing interests.
Additional information
Funded by the Basic Research Project in Shanxi Province (No.202103021224183)
Rights and permissions
About this article
Cite this article
Du, W., Hou, K., Xu, X. et al. Refinement Mechanism of Microstructure of Undercooled Nickel Based Alloys. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 39, 1041–1047 (2024). https://doi.org/10.1007/s11595-024-2968-5
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11595-024-2968-5