Abstract
An extended one-dimensional stress model for the deposition of multilayer films is built based on the existing stress model by considering the influence of deposition conditions. Both thermal stress and intrinsic stress are considered to constitute the final residual stress in the model. The deposition process conditions such as deposition temperature, oxygen pressure, and film growth rate are correlated to the full stress model to analyze the final residual stress distribution, and thus the deformation of the deposited multilayer system under different process conditions. Also, the model is numerically realized with in-house built code. A deposition of Ag-Cu multilayer system is simulated with the as-built extended stress model, and the final residual stresses under different deposition conditions are discussed with part of the results compared with experiment from other literature.
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Floro J A, Hearne S J, Hunter J A, et al. The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films. J Appl Phys, 2001, 89(9): 4886–4897
Floro J A, Chason E, Cammarata R C, et al. Physical origins of intrinsic stresses in Volmer-Weber thin films. MRS Bull, 2002, 27(1): 19–25
Cammarata R C, Trimble T M, Srolovitz D J. Surface stress model for intrinsic stresses in thin films. J Mater Res, 2000, 15(11): 2468–2474
Chason E, Sheldon B W, Freund L B. Origin of compressive residual stress in polycrystalline thin films. Phys Rev Lett, 2002, 88(15): 156103
Hoffman R W. Stresses in thin-films-relevance of grain-boundaries and impurities. Thin Solid Films, 1976, 34(2): 185–190
Nix W D, Clemens B M. Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films. J Mater Res, 1999, 14(8): 3467–3473
Freund L B, Chason E. Model for stress generated upon contact of neighboring islands on the surface of a substrate. J Appl Phys, 2001, 89(9): 4866–4873
Sheldon B W, Ditkowski A, Beresford R, et al. Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion. J Appl Phys, 2003, 94(2): 948–957
Chang C D, Yeh J J, Weng R J, et al. Simulation of nucleation and growth stages for sputtered films. Model Simul Mater Sci Eng, 2010, 18(2): 025010
Steven W L, Paulette C. A simple model for the growth of polycrystalline Si using the kinetic Monte Carlo simulation. Model Simul Mater Sci Eng, 2000, 8(5): 751–762
Hsueh C H. Modeling of elastic deformation of multilayers due to residual stresses and external bending. J Appl Phys, 2002, 91(12): 9652–9656
Hsueh C H. Thermal stresses in elastic multilayer systems. Thin Solid Films, 2002, 418(2): 182–188
Hsueh C H. Stress distribution and curvature in graded semiconductor layers. J Cryst Growth, 2003, 258(3–4): 302–309
Li J P, Fang M, He H B, et al. Model of stress evolution in polycrystalline oxide and composite thin films. Acta Opt Sin, 2012, 32(10): 301–305
Fang M, Hu D F, Shao J. Evolution of stress in evaporated silicon dioxide thin films. Chin Opt Lett, 2010, 8(1): 119–122
Shen Y, Shao S, He H, et al. Influences of thickness ratio of two materials on the residual stress of multilayers. Chin Opt Lett, 2007, 5(s1): 272–274
Zhang S, Zhang H, Zheng L, et al. Heat transfer in physical vapor deposition of polycrystalline multilayers and residual stress. In: ASME 2013 Heat Transfer Summer Conference. Minneapolis: American Society of Mechanical Engineers, 2013. V004T014A013
Ohring M. Materials Science of Thin Films. London: Academic Press, 2001
Read W T, Shockley W. Dislocation models of crystal grain boundaries. Phys Rev, 1950, 78(3): 275–289
Xiao N, Zheng C, Li D, et al. A simulation of dynamic recrystallization by coupling a cellular automaton method with a topology deformation technique. Comp Mater Sci, 2008, 41(3): 366–374
Shull A L, Spaepen F. Measurements of stress during vapor deposition of copper and silver thin films and multilayers. J Appl Phys, 1996, 80(11): 6243–6256
Incropera F P, De-Witt D P. Fundamentals of Heat and Mass Transfer. 2nd ed. New York: Wiley, 1985
Zhang S. Quick Practical Manual for New Metal Material Grades, Performance, Use and Foreign Brands. Hong Kong: China Science and Technology Culture Press, 2005
Haider J, Rahman M, Corcoran B, et al. Simulation of thermal stress in magnetron sputtered thin coating by finite element analysis. J Mater Proc Technol, 2005, 168(1): 36–41
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Zhang, S., Zhang, H. & Zheng, L. Residual stress of physical vapor-deposited polycrystalline multilayers. Sci. China Phys. Mech. Astron. 58, 1–9 (2015). https://doi.org/10.1007/s11433-014-5595-x
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DOI: https://doi.org/10.1007/s11433-014-5595-x