Abstract
In diamond machining of freeform surface on brittle materials, very small machining parameters are necessarily adopted to suppress the brittle fractures, which inevitably leads to low processing efficiency as well as fast tool wear. In the present study, ultra-precision fly cutting is first adopted in processing brittle materials for freeform surfaces to improve machining efficiency and reduce tool wear. In fly cutting, a large swing radius (over 40 mm) is configured between the diamond tool tip and the rotation axis of the spindle, so the workpiece material is intermittently removed by the periodical cut-in and cut-out movement of the diamond tool. The theoretical results show that this unique process generates a very small chip thickness (80 nm) even under large feed rates (9 μm/r) and cutting depths (70 μm), which accordingly improves the machining efficiency without generating brittle fractures. The experimental results show that only 200 min is needed in fly cutting of an F-theta lens with height variation over 50 μm on single-crystal silicon, while over doubled time is needed for conventional slow tool servo. The generated surface is very smooth and uniform with a roughness of only 6 nm Sa. Besides, only micro-ruggedness of diamond tool is formed in fly cutting without the premature appearance of the micro-chips, which enhances tool life and reduces the re-sharpening cost of diamond tools in processing brittle materials.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Hong Z, Liang R (2017) IR-laser assisted additive freeform optics manufacturing. Sci Rep 7:7145
Zhu L, Li Z, Fang F, Huang S, Zhang X (2018) Review on fast tool servo machining of optical freeform surfaces. Int J Adv Manuf Technol 95:2071–2092
Liu H, Xie W, Sun Y, Zhu X, Wang M (2018) Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon. Int J Adv Manuf Technol 95:317–326
Xiao G, To S, Jelenković E (2015) Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon. J Mater Process Technol 225:439–450
Pachaury Y, Tandon P (2017) An overview of electric discharge machining of ceramics and ceramic based composites. J Manuf Process 25:369–390
Azarhoushang B, Soltani B, Zahedi A (2017) Laser-assisted grinding of silicon nitride by picosecond laser. Int J Adv Manuf Technol 93:2517–2529
Liu X-Q, Yu L, Ma Z-C, Chen Q-D (2017) Silicon three-dimensional structures fabricated by femtosecond laser modification with dry etching. Appl Opt 56:2157–2161
Hourmand M, Sarhan AA, Sayuti M (2017) Micro-electrode fabrication processes for micro-EDM drilling and milling: a state-of-the-art review. Int J Adv Manuf Technol 91:1023–1056
Mukaida M, Yan J (2017) Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo. Int J Mach Tools Manuf 115:2–14
Zhang S, Yu J, To S, Xiong Z (2018) A theoretical and experimental study of spindle imbalance induced forced vibration and its effect on surface generation in diamond turning. Int J Mach Tools Manuf 133:61–71
Sun Z, To S, Zhang S, Zhang G (2018) Theoretical and experimental investigation into non-uniformity of surface generation in micro-milling. Int J Mech Sci 140:313–324
Dutterer BS, Lineberger JL, Smilie PJ, Hildebrand DS, Harriman TA, Davies MA, Suleski TJ, Lucca DA (2014) Diamond milling of an Alvarez lens in germanium. Precis Eng 38:398–408
Bai J, Bai Q, Hu C, He X, Pei X (2018) Research on the ductile-mode machining of monocrystalline silicon using polycrystalline diamond (PCD) tools. Int J Adv Manuf Technol 94:1981–1989
Bian R, He N, Ding W, Liu S (2017) A study on the tool wear of PCD micro end mills in ductile milling of ZrO2 ceramics. Int J Adv Manuf Technol 92:2197–2206
Przestacki D, Chwalczuk T, Wojciechowski S (2017) The study on minimum uncut chip thickness and cutting forces during laser-assisted turning of WC/NiCr clad layers. Int J Adv Manuf Technol 91:3887–3898
X.-F. Song, J.-J. Yang, H.-T. Ren, B. Lin, Y. Nakanishi, L. Yin (2018) Ultrasonic assisted high rotational speed diamond machining of dental glass ceramics, Int J Adv Manuf Technol 1–13
Huo D (2013) Micro-cutting: fundamentals and applications. John Wiley & Sons
Krolczyk G, Maruda R, Krolczyk J, Nieslony P, Wojciechowski S, Legutko S (2018) Parametric and nonparametric description of the surface topography in the dry and MQCL cutting conditions. Measurement 121:225–239
Grabon W, Pawlus P (2018) Improvement of the Rpq parameter calculation. Measurement 129:236–244
Krolczyk G, Maruda R, Nieslony P, Wieczorowski M (2016) Surface morphology analysis of duplex stainless steel (DSS) in clean production using the power spectral density. Measurement 94:464–470
Keen D (1971) Some observations on the wear of diamond tools used in piston machining. Wear 17:195–208
Durazo-Cardenas I, Shore P, Luo X, Jacklin T, Impey S, Cox A (2007) 3D characterisation of tool wear whilst diamond turning silicon. Wear 262:340–349
Sun Z, To S, Yu K (2018) One-step generation of hybrid micro-optics with high-frequency diffractive structures on infrared materials by ultra-precision side milling. Opt Express 26:28161–28177
Wang H, Riemer O, Rickens K, Brinksmeier E (2016) On the mechanism of asymmetric ductile–brittle transition in microcutting of (111) CaF2 single crystals. Scr Mater 114:21–26
Blake PN, Scattergood RO (1990) Ductile-regime machining of germanium and silicon. J Am Ceram Soc 73:949–957
Goel S, Luo X, Comley P, Reuben RL, Cox A (2013) Brittle–ductile transition during diamond turning of single crystal silicon carbide. Int J Mach Tools Manuf 65:15–21
Arif M, Rahman M, San WY (2012) An experimental investigation into micro ball end-milling of silicon. J Manuf Process 14:52–61
Yu D, Wong Y, Hong G (2011) Ultraprecision machining of micro-structured functional surfaces on brittle materials. J Micromech Microeng 21:095011
Sun Z, To S, Zhang S (2018) A novel ductile machining model of single-crystal silicon for freeform surfaces with large azimuthal height variation by ultra-precision fly cutting. Int J Mach Tools Manuf 135:1–11
Goel S, Luo X, Agrawal A, Reuben RL (2015) Diamond machining of silicon: a review of advances in molecular dynamics simulation. Int J Mach Tools Manuf 88:131–164
Skorupa W, Yankov R (1996) Carbon-mediated effects in silicon and in silicon-related materials. Mater Chem Phys 44:101–143
Sanz-Navarro C, Kenny S, Smith R (2004) Atomistic simulations of structural transformations of silicon surfaces under nanoindentation. Nanotechnology 15:692–697
Zong W, Sun T, Li D, Cheng K, Liang Y (2008) XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer. Int J Mach Tools Manuf 48:1678–1687
Pantea C (2004) Kinetics of diamond-silicon reaction under high pressure-high temperature conditions
Funding
This work was supported partially by the Research Committee of The Hong Kong Polytechnic University (Project Code: RUNS).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Sun, Z., To, S. & Yu, K.M. An investigation in the ultra-precision fly cutting of freeform surfaces on brittle materials with high machining efficiency and low tool wear. Int J Adv Manuf Technol 101, 1583–1593 (2019). https://doi.org/10.1007/s00170-018-3013-7
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-018-3013-7