Abstract
This chapter reviews the package structure materials. First of all, the lead frames are introduced as carriers for IC chips. Then, the electronic packaging materials are illustrated, including metal, ceramic, and plastic packaging materials. It is worth noting that the organic packaging substrates have two types, i.e., rigid substrates and flexible substrates. Next, the metal bonding wires are illustrated, including copper, alloy of copper, aluminum, alloy of aluminum bonding wires, and inner leads materials. Finally, the electrically conductive adhesives, die attach adhesives, solder, and under-fill materials are addressed.
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Yang, D., Yuan, T., Yu, X. (2024). Package Structure Materials. In: Wang, Y., Chi, MH., Lou, J.JC., Chen, CZ. (eds) Handbook of Integrated Circuit Industry. Springer, Singapore. https://doi.org/10.1007/978-981-99-2836-1_80
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DOI: https://doi.org/10.1007/978-981-99-2836-1_80
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Publisher Name: Springer, Singapore
Print ISBN: 978-981-99-2835-4
Online ISBN: 978-981-99-2836-1
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