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Investigation on Reactive Power Compensation Using STATCOM

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Smart and Sustainable Technologies: Rural and Tribal Development Using IoT and Cloud Computing

Part of the book series: Advances in Sustainability Science and Technology ((ASST))

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Abstract

The power consumption when increased causes transmission lines to get nearer or sometimes beyond their transfer capacities which results in overload lines and blockage. The shunt connected FACTS devices are the solution for compensation of reactive power and also reduction in problems related to transmission lines. STATCOM, i.e. Static Synchronous Compensator is a variety of shunt FACTS devices and has been used for compensation of reactive power. The difficulties of compensation of reactive power can be overcome with the use of STATCOM. The paper basically explains how a STATCOM can compensate the reactive power which is not very much useful for the machine.

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Author information

Authors and Affiliations

  1. Department of Electrical and Electronics Engineering, International Institute of Information and Technology, Bhubaneswar, India

    Debani Prasad Mishra, Prangya Panda, Sukanya Sahoo & Swosti Pradhan

Authors
  1. Debani Prasad Mishra
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  2. Prangya Panda
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  3. Sukanya Sahoo
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  4. Swosti Pradhan
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Corresponding author

Correspondence to Debani Prasad Mishra .

Editor information

Editors and Affiliations

  1. Department of Computer Science and Engineering, SOA University, Bhubaneswar, Odisha, India

    Srikanta Patnaik

  2. Department of Radio Communications and Video Technology, Technical University of Sofia, Sofia, Bulgaria

    Roumen Kountchev

  3. School of Management, Victoria University of Wellington, Wellington, Wellington, New Zealand

    Vipul Jain

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Mishra, D.P., Panda, P., Sahoo, S., Pradhan, S. (2022). Investigation on Reactive Power Compensation Using STATCOM. In: Patnaik, S., Kountchev, R., Jain, V. (eds) Smart and Sustainable Technologies: Rural and Tribal Development Using IoT and Cloud Computing. Advances in Sustainability Science and Technology. Springer, Singapore. https://doi.org/10.1007/978-981-19-2277-0_24

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