Abstract
The evolution towards a digital society is indisputable and the development of online tools adapted to education is becoming a priority. At the same time, the technologies that allow the development of these tools as well as the connected objects become more and more complex with a need for know-how as well for the design of these objects as for their manufacture and production. Let us mention that the connected objects cover a large spectrum of applications opened to other disciplines. A new approach to education is needed. Following a presentation of the context, this article discusses the strategy that has been adopted to successfully combine engineering learning, and more especially the microelectronics training with the e-learning and the acquisition of know-how through practice. Because practical training is becoming more and more complex and costly, the trend is to share platforms dedicated to education within the framework of a network. This was set up in France for more than thirty years. The evolution of this network in this new context of digital society with an increasing priority of development of Internet of Things is presented and discussed.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Similar content being viewed by others
References
Moore, G.E.: Cramming more components onto integrated circuits. Electron. Mag. 38(8), 114–117 (1965)
Simonite, T.: Moore’s Law Is Dead. Now What?”. MIT Technology Review, 13 May 2016. https://www.technologyreview.com/s/601441/moores-law-is-dead-now-what/
Stuchlikova, L., Kosa, A., Benko, P., Donoval, D.: Massive open online courses in microelectronics education. In: Proceedings of 10th EWME 2014, Tallinn, Estonia, 14–16 May, pp. 31–36 (2014)
Fox, A.: From MOOCs to SPOCs. In: Proceedings of ACM, vol. 56, no. 12, pp. 38–40 (2013)
Bonnaud, O., Fesquet, L.: MOOC and the practice in electrical and information engineering: complementary approaches. In: Proceedings of IEEE ITHET Conference, Istanbul, Turkey, 8–10 September 2016. https://doi.org/10.1109/ithet.2016.7760732
Bonnaud, O., Danto, Y., Kuang, Y., Yuan, L.: International flipped class for Chinese Honors bachelor students in the frame of multidisciplinary fields: reliability and microelectronics. In: Proceedings of ICATI 2017 Conference, Samui Island, Thailand, 25 June, p. 12 (2017)
Bergeron, B.: Developing Serious Games (Game Development). Delmar Thomson Learning, Boston (2005)
Matheron, G.: Keynote, Microelectronics evolution, European, Microelectronics Summit, Paris, France, November 2014
Bonnaud, O., Fesquet, L.: A prospective on education of new generations of devices in the FDSOI and FinFET technologies: from the technological process to the circuit design specifications. In: Proceedings of SBMicro 2014, Aracaju-Sergipe, Brazil, pp. 1–4 (2014). https://doi.org/10.1109/sbmicro.2014.6940081
Bonnaud, O., Fesquet, L.: Towards multidisciplinarity for microelectronics education: a strategy of the French national network. In: Proceedings of IEEE Microelectronics System Education (MSE) conference, Pittsburg, PA, USA, pp. 1–4. IEEE (2015). ISBN 978-1-4799-9915-6/15/$31.00 ©2015
Bonnaud, O., Fesquet, L.: Practice in microelectronics education as a mandatory complement to the future numeric-based pedagogy: a strategy of the French national network. In: Proceedings of EWME, Southampton, UK, May 2016, pp. 1–8. IEEE (2016). https://doi.org/10.1109/EWME.2016.7496460
Bonnaud, O., Fesquet, L.: Multidisciplinary topics for the innovative education in microelectronics and its applications. In: Proceedings of 15th International Conference on Information Technology Based Higher Education and Training, Lisboa, Portugal, pp. 1–5 (2015). https://doi.org/10.1109/ITHET.2015.7217961
Bonnaud, O.: New approach for sensors and connecting objects involving microelectronic multidisciplinarity for a wide spectrum of applications. Int. J. Plasma Environ. Sci. Technol. 10(2), 115–120 (2016)
CNFM: Coordination Nationale pour la formation en Microélectronique et nanotechnologies (CNFM). www.cnfm.fr; GIP-CNFM: Public Interest Group, administrative structure of the CNFM. Accessed Jan 2018
Bonnaud, O., Gentil, P., et al.: GIP-CNFM: a French education network moving from microelectronics to nanotechnologies. In: Proceedings of EDUCON 2011, Amman, Jordan 3–6 April 2011, pp. 122–127 (2011). ISBN 978-1-61284-641-5
Garlock, S.: Is Small Beautiful? Online education looks beyond the MOOC. Harvard Magazine, July–Aug 2015. http://harvardmagazine.com/2015/07/is-small-beautiful. Accessed Jan 2018
For example Bonnaud, O.: https://microelectronique.univ-rennes1.fr/fr/index.html. Accessed Jan 2018
Meillère, S., Ferrero, F., Pannier, P., Jacquemod, G.: Réseaux de Capteurs Intelligents RECAIN/WSN. In: Proceedings of JPCNFM 2014, Saint-Malo, 19 November 2014
Fesquet, L., Morin-Allory, K., Rolland-Girod, R.: Un projet de microélectronique numérique original: Contrôle autonome d’un micro-drône par caméras externes. J. J3EA 14 (2015). https://doi.org/10.1051/j3ea/2015021
Acknowledgment
The author wants to thank all the members of the French GIP-CNFM network for they contribution to many innovative realizations. This work is financially supported by French Higher Education Ministry and by IDEFI-FINMINA program (ANR-11-IDFI-0017). A special thanks to L. Chagoya-Garzon, secretary of GIP-CNFM for her fruitful advice for the proof reading of this paper.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer International Publishing AG, part of Springer Nature
About this paper
Cite this paper
Bonnaud, O. (2019). New Vision in Microelectronics Education: Smart e-Learning and Know-How, A Complementary Approach. In: Uskov, V., Howlett, R., Jain, L., Vlacic, L. (eds) Smart Education and e-Learning 2018. KES SEEL-18 2018. Smart Innovation, Systems and Technologies, vol 99. Springer, Cham. https://doi.org/10.1007/978-3-319-92363-5_25
Download citation
DOI: https://doi.org/10.1007/978-3-319-92363-5_25
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-92362-8
Online ISBN: 978-3-319-92363-5
eBook Packages: Intelligent Technologies and RoboticsIntelligent Technologies and Robotics (R0)